The parts under NSN 5962-01-374-8573 of Microcircuit Memory manufactured by Xicor Ltd, Ge Aviation Systems Llc is available in our inventory. An ASAP Semiconductor Website, ASAP Aviation Stock has access to over three billion parts, paired with easy-to-use search engines that enable our customers to browse through our inventory quickly and efficiently. Our focus on quality control has earned us our AS9120B, ISO 9001:2015, and FAA 0056B certification, and we are the only independent distributor with a No China Sourcing pledge. If you are ready to get started, you can send us a Request for Quote for the parts with 5962-01-374-8573 from this webpage, and one of our account managers will give you a quote for parts like X28C256C6743, 169733-03 within fifteen minutes.
Alternative NSN: 5962-01-374-8573 |
Item Name:Microcircuit Memory |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 013748573 |
NCB Code: USA (01) |
Manufacturers: Ge Aviation Systems Llc , Xicor Ltd |
Part No | Manufacturer | Item Name | QTY | RFQ |
---|---|---|---|---|
X28C256C6743 | xicor ltd | microcircuit memory | Avl | RFQ |
169733-03 | ge aviation systems llc | microcircuit memory | Avl | RFQ |
MRC | Criteria | Characteristic |
---|---|---|
CZEP | Capitance Rating Per Characteristic | 6.00 INPUT PICOFARADS MAXIMUM AND 10.00 OUTPUT PICOFARADS MAXIMUM |
TTQY | Terminal Type And Quantity | 32 LEADLESS |
CTQX | Current Rating Per Characteristic | 60.00 MILLIAMPERES MAXIMUM SUPPLY |
MRC | Decoded Requirement | Clear Text Reply |
FEAT | Special Features | WITH 64-BYTE PAGE WRITE CAPABILITY |
AFJQ | Storage Temp Range | -65.0 TO 150.0 DEG CELSIUS |
CQZP | Input Circuit Pattern | 26 INPUT |
CBBL | Features Provided | ELECTROSTATIC SENSITIVE AND BIDIRECTIONAL AND W/ENABLE AND W/INHIBIT AND MONOLITHIC |
CQSJ | Inclosure Material | CERAMIC |
ADAT | Body Width | 0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM |
TEST | Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
CWSG | Terminal Surface Treatment | SOLDER |
ADAQ | Body Length | 0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM |
AEHX | Maximum Power Dissipation Rating | 1.0 WATTS |
ADAU | Body Height | 0.105 INCHES MAXIMUM |
CQSZ | Inclosure Configuration | LEADLESS FLAT PACK |
AFGA | Operating Temp Range | -55.0 TO 125.0 DEG CELSIUS |
CZEQ | Time Rating Per Chacteristic | 350.00 NANOSECONDS MAXIMUM ACCESS |
CZER | Memory Device Type | EEPROM |
CQWX | Output Logic Form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CZEN | Voltage Rating And Type Per Characteristic | -1.00 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
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