The parts under NSN 5962-01-370-0998 of Microcircuit Memory manufactured by Xicor Ltd, Seeq Technology Inc, Paaesikunta Logistiikkaosasto, Dla Land And Maritime, Atmel Corporation is available in our inventory. An ASAP Semiconductor Website, ASAP Aviation Stock has access to over three billion parts, paired with easy-to-use search engines that enable our customers to browse through our inventory quickly and efficiently. Our focus on quality control has earned us our AS9120B, ISO 9001:2015, and FAA 0056B certification, and we are the only independent distributor with a No China Sourcing pledge. If you are ready to get started, you can send us a Request for Quote for the parts with 5962-01-370-0998 from this webpage, and one of our account managers will give you a quote for parts like X28C010FMB-25, FM28C010-250, 10133974, 5962-38267, 5962-3826701MZB within fifteen minutes.
Alternative NSN: 5962-01-370-0998 |
Item Name:Microcircuit Memory |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 013700998 |
NCB Code: USA (01) |
Manufacturers: Atmel Corporation , Dla Land And Maritime , Paaesikunta Logistiikkaosasto , Seeq Technology Inc , Xicor Ltd |
Part No | Manufacturer | Item Name | QTY | RFQ |
---|---|---|---|---|
X28C010FMB-25 | xicor ltd | microcircuit memory | Avl | RFQ |
FM28C010-250 | seeq technology inc | microcircuit memory | Avl | RFQ |
10133974 | paaesikunta logistiikkaosasto | microcircuit memory | Avl | RFQ |
5962-38267 | dla land and maritime | microcircuit memory | Avl | RFQ |
5962-3826701MZB | dla land and maritime | microcircuit memory | Avl | RFQ |
5962-3826701MZA | dla land and maritime | microcircuit memory | Avl | RFQ |
5962-3826701MZX | dla land and maritime | microcircuit memory | Avl | RFQ |
AT28C010-25FM 883X | atmel corporation | microcircuit memory | Avl | RFQ |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.830 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.430 INCHES MINIMUM AND 0.488 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.090 INCHES MINIMUM AND 0.120 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | BURN IN AND HERMETICALLY SEALED AND BIDIRECTIONAL AND ERASABLE AND ELECTROSTATIC SENSITIVE AND PROGRAMMABLE AND MONOLITHIC |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 27 INPUT |
CTQX | CURRENT RATING PER CHARACTERISTIC | 80.00 MILLIAMPERES NOMINAL TOTAL SUPPLY |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 6.0 VOLTS MAXIMUM POWER SOURCE |
CZER | MEMORY DEVICE TYPE | EEPROM |
CZES | HYBRID TECHNOLOGY TYPE | MONOLITHIC |
TTQY | TERMINAL TYPE AND QUANTITY | 32 FLAT LEADS |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
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