The parts under NSN 5962-01-336-3383 of Microcircuit Memory manufactured by Thales Sa, Alcatel Lucent France, Dla Land And Maritime, Alcatel Telspace Unite Electronique, Cypress Semiconductor Inc is available in our inventory. An ASAP Semiconductor Website, ASAP Aviation Stock has access to over three billion parts, paired with easy-to-use search engines that enable our customers to browse through our inventory quickly and efficiently. Our focus on quality control has earned us our AS9120B, ISO 9001:2015, and FAA 0056B certification, and we are the only independent distributor with a No China Sourcing pledge. If you are ready to get started, you can send us a Request for Quote for the parts with 5962-01-336-3383 from this webpage, and one of our account managers will give you a quote for parts like 99167399, 77089806, 5962-8871312RX, 5962-88713, ROM PROM HEAD 217 within fifteen minutes.
Alternative NSN: 5962-01-336-3383 |
Item Name:Microcircuit Memory |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 013363383 |
NCB Code: USA (01) |
Manufacturers: Alcatel Lucent France , Alcatel Telspace Unite Electronique , Cypress Semiconductor Inc , Dla Land And Maritime , Thales Sa |
Part No | Manufacturer | Item Name | QTY | RFQ |
---|---|---|---|---|
99167399 | thales sa | microcircuit memory | Avl | RFQ |
77089806 | alcatel lucent france | microcircuit memory | Avl | RFQ |
5962-8871312RX | dla land and maritime | microcircuit memory | Avl | RFQ |
77089806 | alcatel telspace unite electronique | microcircuit memory | Avl | RFQ |
5962-88713 | dla land and maritime | microcircuit memory | Avl | RFQ |
ROM PROM HEAD 217 | dla land and maritime | microcircuit memory | Avl | RFQ |
5962-8871312RB | dla land and maritime | microcircuit memory | Avl | RFQ |
5962-8871312RA | dla land and maritime | microcircuit memory | Avl | RFQ |
PALC16R4-20DMB | cypress semiconductor inc | microcircuit memory | Avl | RFQ |
91681327 | thales sa | microcircuit memory | Avl | RFQ |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 1.060 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.310 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.185 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | BURN IN AND ELECTROSTATIC SENSITIVE AND MONOLITHIC AND PROGRAMMABLE |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQZP | INPUT CIRCUIT PATTERN | 16 INPUT |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-8 MIL-M-38510 |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 20.00 NANOSECONDS ACC/PAC DETECTOR TINT CONTROL MAXIMUM |
CZER | MEMORY DEVICE TYPE | PAL |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 20 PRINTED CIRCUIT |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CTQX | CURRENT RATING PER CHARACTERISTIC | 70.00 MILLIAMPERES REVERSE CURRENT, DC ABSOLUTE |
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