The parts under NSN 5962-01-332-5751 of Microcircuit Memory manufactured by Texas Instruments Incorporated, Dla Land And Maritime, Mmi Amd is available in our inventory. An ASAP Semiconductor Website, ASAP Aviation Stock has access to over three billion parts, paired with easy-to-use search engines that enable our customers to browse through our inventory quickly and efficiently. Our focus on quality control has earned us our AS9120B, ISO 9001:2015, and FAA 0056B certification, and we are the only independent distributor with a No China Sourcing pledge. If you are ready to get started, you can send us a Request for Quote for the parts with 5962-01-332-5751 from this webpage, and one of our account managers will give you a quote for parts like TIBPAL16R8-30MWB, 5962-8515506BSA, 5962-8515506BSX, 5962-8515506BSB, 5962-8515506SB within fifteen minutes.
Alternative NSN: 5962-01-332-5751 |
Item Name:Microcircuit Memory |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 013325751 |
NCB Code: USA (01) |
Manufacturers: Dla Land And Maritime , Mmi Amd , Texas Instruments Incorporated |
Part No | Manufacturer | Item Name | QTY | RFQ |
---|---|---|---|---|
TIBPAL16R8-30MWB | texas instruments incorporated | microcircuit memory | Avl | RFQ |
5962-8515506BSA | dla land and maritime | microcircuit memory | Avl | RFQ |
5962-8515506BSX | dla land and maritime | microcircuit memory | Avl | RFQ |
5962-8515506BSB | dla land and maritime | microcircuit memory | Avl | RFQ |
5962-8515506SB | dla land and maritime | microcircuit memory | Avl | RFQ |
PAL16R8B-2MW 883B | mmi amd | microcircuit memory | Avl | RFQ |
5962-8515506SX | dla land and maritime | microcircuit memory | Avl | RFQ |
5962-8515506SA | dla land and maritime | microcircuit memory | Avl | RFQ |
5962-85155 | dla land and maritime | microcircuit memory | Avl | RFQ |
MRC | Criteria | Characteristic |
---|---|---|
ABMK | OVERALL WIDTH | 0.745 INCHES MINIMUM AND 1.040 INCHES MAXIMUM |
ADAQ | BODY LENGTH | 0.540 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 0.6 WATTS |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | BIPOLAR AND MONOLITHIC AND PROGRAMMABLE AND W/CLOCK AND 3-STATE OUTPUT AND W/ENABLE |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
CQWX | OUTPUT LOGIC FORM | BIPOLAR METAL-OXIDE SEMICONDUCTOR |
CQZP | INPUT CIRCUIT PATTERN | 16 INPUT |
CTQX | CURRENT RATING PER CHARACTERISTIC | 12.00 MILLIAMPERES AVERAGE FORWARD CURRENT AVERAGED OVER A FULL 60-HZ CYCLE NOT APPLICABLE |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZER | MEMORY DEVICE TYPE | PAL |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 20 FLAT LEADS |
CZEQ | TIME RATING PER CHACTERISTIC | 20.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 20.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | F-9 MIL-M-38510 |
ADAU | BODY HEIGHT | 0.045 INCHES MINIMUM AND 0.100 INCHES MAXIMUM |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MAXIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
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