The parts under NSN 5962-01-319-7418 of Microcircuit Memory manufactured by Freescale Semiconductor Inc, Dla Land And Maritime, Sri International, Paaesikunta Logistiikkaosasto is available in our inventory. An ASAP Semiconductor Website, ASAP Aviation Stock has access to over three billion parts, paired with easy-to-use search engines that enable our customers to browse through our inventory quickly and efficiently. Our focus on quality control has earned us our AS9120B, ISO 9001:2015, and FAA 0056B certification, and we are the only independent distributor with a No China Sourcing pledge. If you are ready to get started, you can send us a Request for Quote for the parts with 5962-01-319-7418 from this webpage, and one of our account managers will give you a quote for parts like 10545 BFAJC, 5962-8856001FB, 5962-88560, 5962-8856001FA, 10133977 within fifteen minutes.
| Alternative NSN: 5962-01-319-7418 |
| Item Name:Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 013197418 |
| NCB Code: USA (01) |
| Manufacturers: Dla Land And Maritime , Freescale Semiconductor Inc , Paaesikunta Logistiikkaosasto , Sri International |
| Part No | Manufacturer | Item Name | QTY | RFQ |
|---|---|---|---|---|
| 10545 BFAJC | freescale semiconductor inc | microcircuit memory | Avl | RFQ |
| 5962-8856001FB | dla land and maritime | microcircuit memory | Avl | RFQ |
| 5962-88560 | dla land and maritime | microcircuit memory | Avl | RFQ |
| 5962-8856001FA | sri international | microcircuit memory | Avl | RFQ |
| 10133977 | paaesikunta logistiikkaosasto | microcircuit memory | Avl | RFQ |
| 5962-8856001FA | dla land and maritime | microcircuit memory | Avl | RFQ |
| 5962-8856001FX | dla land and maritime | microcircuit memory | Avl | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.440 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.045 INCHES MINIMUM AND 0.085 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND POSITIVE OUTPUTS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | EMITTER-COUPLED LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | F-5 MIL-M-38510 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 8.0 VOLTS MAXIMUM POWER SOURCE |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| CZER | MEMORY DEVICE TYPE | RAM |
| TTQY | TERMINAL TYPE AND QUANTITY | 16 FLAT LEADS |
| ADAT | BODY WIDTH | 0.245 INCHES MINIMUM AND 0.285 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 827.0 MILLIWATTS |
| CZEQ | TIME RATING PER CHACTERISTIC | 15.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 15.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
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