The parts under NSN 5962-01-303-3548 of Microcircuit Memory manufactured by Integrated Device Technology Inc, Bae Systems Controls Inc, Thales Uk Limited is available in our inventory. An ASAP Semiconductor Website, ASAP Aviation Stock has access to over three billion parts, paired with easy-to-use search engines that enable our customers to browse through our inventory quickly and efficiently. Our focus on quality control has earned us our AS9120B, ISO 9001:2015, and FAA 0056B certification, and we are the only independent distributor with a No China Sourcing pledge. If you are ready to get started, you can send us a Request for Quote for the parts with 5962-01-303-3548 from this webpage, and one of our account managers will give you a quote for parts like IDT7132LA120CB, 312A1837P3, 28734-1600-0004 within fifteen minutes.
Alternative NSN: 5962-01-303-3548 |
Item Name:Microcircuit Memory |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 013033548 |
NCB Code: USA (01) |
Manufacturers: Bae Systems Controls Inc , Integrated Device Technology Inc , Thales Uk Limited |
Part No | Manufacturer | Item Name | QTY | RFQ |
---|---|---|---|---|
IDT7132LA120CB | integrated device technology inc | microcircuit memory | Avl | RFQ |
312A1837P3 | bae systems controls inc | microcircuit memory | Avl | RFQ |
28734-1600-0004 | thales uk limited | microcircuit memory | Avl | RFQ |
MRC | Criteria | Characteristic |
---|---|---|
ABKW | OVERALL HEIGHT | 0.220 INCHES MINIMUM AND 0.360 INCHES MAXIMUM |
ADAQ | BODY LENGTH | 2.370 INCHES MINIMUM AND 2.430 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.550 INCHES MINIMUM AND 0.610 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.030 INCHES MINIMUM AND 0.170 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 44 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 120.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 120.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND W/ENABLE AND ELECTROSTATIC SENSITIVE AND MONOLITHIC |
CZER | MEMORY DEVICE TYPE | RAM |
TTQY | TERMINAL TYPE AND QUANTITY | 48 PRINTED CIRCUIT |
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