The parts under NSN 5962-01-302-3422 of Microcircuit Memory manufactured by Dla Land And Maritime, Cypress Semiconductor Inc, Atmel Corporation is available in our inventory. An ASAP Semiconductor Website, ASAP Aviation Stock has access to over three billion parts, paired with easy-to-use search engines that enable our customers to browse through our inventory quickly and efficiently. Our focus on quality control has earned us our AS9120B, ISO 9001:2015, and FAA 0056B certification, and we are the only independent distributor with a No China Sourcing pledge. If you are ready to get started, you can send us a Request for Quote for the parts with 5962-01-302-3422 from this webpage, and one of our account managers will give you a quote for parts like ROM PROM HEAD 185, PALC22V10-30QMB, AT22V10-30LM 883, 5962-8753902B3X, 5962-8753902B3B within fifteen minutes.
| Alternative NSN: 5962-01-302-3422 |
| Item Name:Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 013023422 |
| NCB Code: USA (01) |
| Manufacturers: Atmel Corporation , Cypress Semiconductor Inc , Dla Land And Maritime |
| Part No | Manufacturer | Item Name | QTY | RFQ |
|---|---|---|---|---|
| ROM PROM HEAD 185 | dla land and maritime | microcircuit memory | Avl | RFQ |
| PALC22V10-30QMB | cypress semiconductor inc | microcircuit memory | Avl | RFQ |
| AT22V10-30LM 883 | atmel corporation | microcircuit memory | Avl | RFQ |
| 5962-8753902B3X | dla land and maritime | microcircuit memory | Avl | RFQ |
| 5962-8753902B3B | dla land and maritime | microcircuit memory | Avl | RFQ |
| 5962-8753902B3A | dla land and maritime | microcircuit memory | Avl | RFQ |
| 5962-87539023X | dla land and maritime | microcircuit memory | Avl | RFQ |
| 5962-87539023B | dla land and maritime | microcircuit memory | Avl | RFQ |
| 5962-87539023A | dla land and maritime | microcircuit memory | Avl | RFQ |
| 5962-87539 | dla land and maritime | microcircuit memory | Avl | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.442 INCHES MINIMUM AND 0.460 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.442 INCHES MINIMUM AND 0.460 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.2 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE AND MONOLITHIC |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQZP | INPUT CIRCUIT PATTERN | 22 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-4 MIL-M-38510 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 28 LEADLESS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CZEQ | TIME RATING PER CHACTERISTIC | 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | PAL |
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