The parts under NSN 5962-01-275-0836 of Microcircuit Memory manufactured by Xicor Ltd, Advanced Micro Devices Inc, Hamilton Sundstrand Corporation, Paaesikunta Logistiikkaosasto is available in our inventory. An ASAP Semiconductor Website, ASAP Aviation Stock has access to over three billion parts, paired with easy-to-use search engines that enable our customers to browse through our inventory quickly and efficiently. Our focus on quality control has earned us our AS9120B, ISO 9001:2015, and FAA 0056B certification, and we are the only independent distributor with a No China Sourcing pledge. If you are ready to get started, you can send us a Request for Quote for the parts with 5962-01-275-0836 from this webpage, and one of our account managers will give you a quote for parts like X286AEMB-25, X2864BGMB, X2864BEMB, X2864AEMB, AM2864AE-300 BUA within fifteen minutes.
| Alternative NSN: 5962-01-275-0836 |
| Item Name:Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 012750836 |
| NCB Code: USA (01) |
| Manufacturers: Advanced Micro Devices Inc , Hamilton Sundstrand Corporation , Paaesikunta Logistiikkaosasto , Xicor Ltd |
| Part No | Manufacturer | Item Name | QTY | RFQ |
|---|---|---|---|---|
| X286AEMB-25 | xicor ltd | microcircuit memory | Avl | RFQ |
| X2864BGMB | xicor ltd | microcircuit memory | Avl | RFQ |
| X2864BEMB | xicor ltd | microcircuit memory | Avl | RFQ |
| X2864AEMB | xicor ltd | microcircuit memory | Avl | RFQ |
| AM2864AE-300 BUA | advanced micro devices inc | microcircuit memory | Avl | RFQ |
| 795073-1 | hamilton sundstrand corporation | microcircuit memory | Avl | RFQ |
| 10133818 | paaesikunta logistiikkaosasto | microcircuit memory | Avl | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.560 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.458 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.085 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND ELECTROSTATIC SENSITIVE AND ERASABLE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 26 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | PROM |
| TEST | TEST DATA DOCUMENT | 73030-795073 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWI |
| TTQY | TERMINAL TYPE AND QUANTITY | 32 LEADLESS |
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