The parts under NSN 5962-01-274-7927 of Microcircuit Memory manufactured by Xicor Ltd, Honeywell International Inc, Hamilton Sundstrand Corporation, Dla Land And Maritime, Paaesikunta Logistiikkaosasto is available in our inventory. An ASAP Semiconductor Website, ASAP Aviation Stock has access to over three billion parts, paired with easy-to-use search engines that enable our customers to browse through our inventory quickly and efficiently. Our focus on quality control has earned us our AS9120B, ISO 9001:2015, and FAA 0056B certification, and we are the only independent distributor with a No China Sourcing pledge. If you are ready to get started, you can send us a Request for Quote for the parts with 5962-01-274-7927 from this webpage, and one of our account managers will give you a quote for parts like X20C04EMB-25, 8507005-255, 795099-1, 5R8067-042-3002, 5962-8771201YA within fifteen minutes.
| Alternative NSN: 5962-01-274-7927 |
| Item Name:Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 012747927 |
| NCB Code: USA (01) |
| Manufacturers: Dla Land And Maritime , Hamilton Sundstrand Corporation , Honeywell International Inc , Paaesikunta Logistiikkaosasto , Xicor Ltd |
| Part No | Manufacturer | Item Name | QTY | RFQ |
|---|---|---|---|---|
| X20C04EMB-25 | xicor ltd | microcircuit memory | Avl | RFQ |
| 8507005-255 | honeywell international inc | microcircuit memory | Avl | RFQ |
| 795099-1 | hamilton sundstrand corporation | microcircuit memory | Avl | RFQ |
| 5R8067-042-3002 | hamilton sundstrand corporation | microcircuit memory | Avl | RFQ |
| 5962-8771201YA | dla land and maritime | microcircuit memory | Avl | RFQ |
| 10133817 | paaesikunta logistiikkaosasto | microcircuit memory | Avl | RFQ |
| X2004EMB-25 | xicor ltd | microcircuit memory | Avl | RFQ |
| X2004EM-25 C6317 | xicor ltd | microcircuit memory | Avl | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.560 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.458 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.085 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND BIDIRECTIONAL |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 21 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | RAM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 32 LEADLESS |
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