The parts under NSN 5962-01-270-3486 of Microcircuit Memory manufactured by Epson Electronics America Inc, Rockwell Collins Inc, Integrated Device Technology Inc, Hitachi Ltd, Bae Systems Operations Limited Dba Bae Systems Plc is available in our inventory. An ASAP Semiconductor Website, ASAP Aviation Stock has access to over three billion parts, paired with easy-to-use search engines that enable our customers to browse through our inventory quickly and efficiently. Our focus on quality control has earned us our AS9120B, ISO 9001:2015, and FAA 0056B certification, and we are the only independent distributor with a No China Sourcing pledge. If you are ready to get started, you can send us a Request for Quote for the parts with 5962-01-270-3486 from this webpage, and one of our account managers will give you a quote for parts like IDT6116SA150DB, 351-5642-042, HM6116-3, 9481-00085, 6116S150DB within fifteen minutes.
| Alternative NSN: 5962-01-270-3486 |
| Item Name:Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 012703486 |
| NCB Code: USA (01) |
| Manufacturers: Bae Systems Operations Limited Dba Bae Systems Plc , Epson Electronics America Inc , Hitachi Ltd , Industrial Electronic Engineers , Integrated Device Technology Inc , Rockwell Collins Inc |
| Part No | Manufacturer | Item Name | QTY | RFQ |
|---|---|---|---|---|
| IDT6116SA150DB | epson electronics america inc | microcircuit memory | Avl | RFQ |
| 351-5642-042 | rockwell collins inc | microcircuit memory | Avl | RFQ |
| IDT6116SA150DB | integrated device technology inc | microcircuit memory | Avl | RFQ |
| HM6116-3 | hitachi ltd | microcircuit memory | Avl | RFQ |
| 9481-00085 | bae systems operations limited dba bae systems plc | microcircuit memory | Avl | RFQ |
| 6116S150DB | integrated device technology inc | microcircuit memory | Avl | RFQ |
| 47185-01 | industrial electronic engineers | microcircuit memory | Avl | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| AEHX | MAXIMUM POWER DISSIPATION RATING | 550.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | STATIC OPERATION AND HIGH SPEED AND ASYNCHRONOUS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 14 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.0 VOLTS NOMINAL POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 150.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
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