The parts under NSN 5962-01-266-1459 of Microcircuit Memory manufactured by Micron Technology Inc, At And T Technologies Inc, Dla Land And Maritime, Texas Instruments Incorporated, Fujitsu Microelectronics Inc is available in our inventory. An ASAP Semiconductor Website, ASAP Aviation Stock has access to over three billion parts, paired with easy-to-use search engines that enable our customers to browse through our inventory quickly and efficiently. Our focus on quality control has earned us our AS9120B, ISO 9001:2015, and FAA 0056B certification, and we are the only independent distributor with a No China Sourcing pledge. If you are ready to get started, you can send us a Request for Quote for the parts with 5962-01-266-1459 from this webpage, and one of our account managers will give you a quote for parts like MT1259EC-12883C, M41256HN-12, 85152, 8515203XA, SMJ4256-12FVS within fifteen minutes.
| Alternative NSN: 5962-01-266-1459 |
| Item Name:Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 012661459 |
| NCB Code: USA (01) |
| Manufacturers: At And T Technologies Inc , Dla Land And Maritime , Fujitsu Microelectronics Inc , Micron Technology Inc , Texas Instruments Incorporated |
| Part No | Manufacturer | Item Name | QTY | RFQ |
|---|---|---|---|---|
| MT1259EC-12883C | micron technology inc | microcircuit memory | Avl | RFQ |
| M41256HN-12 | at and t technologies inc | microcircuit memory | Avl | RFQ |
| 85152 | dla land and maritime | microcircuit memory | Avl | RFQ |
| 8515203XA | dla land and maritime | microcircuit memory | Avl | RFQ |
| SMJ4256-12FVS | texas instruments incorporated | microcircuit memory | Avl | RFQ |
| 8515203XX | dla land and maritime | microcircuit memory | Avl | RFQ |
| 8515203XB | dla land and maritime | microcircuit memory | Avl | RFQ |
| MB81257-12 | fujitsu microelectronics inc | microcircuit memory | Avl | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.505 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.305 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.100 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND DYNAMIC AND W/ENABLE AND W/STROBE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 13 INPUT |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 50.00 MILLIAMPERES NOMINAL OUTPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM TOTAL SUPPLY |
| CZEQ | TIME RATING PER CHACTERISTIC | 120.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 120.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | RAM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 18 LEADLESS |
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