The parts under NSN 5962-01-234-3570 of Microcircuit Memory manufactured by Dla Land And Maritime, Raytheon Company, Raytheon Technical Services Company, National Semiconductor Corp, Intel Corporation is available in our inventory. An ASAP Semiconductor Website, ASAP Aviation Stock has access to over three billion parts, paired with easy-to-use search engines that enable our customers to browse through our inventory quickly and efficiently. Our focus on quality control has earned us our AS9120B, ISO 9001:2015, and FAA 0056B certification, and we are the only independent distributor with a No China Sourcing pledge. If you are ready to get started, you can send us a Request for Quote for the parts with 5962-01-234-3570 from this webpage, and one of our account managers will give you a quote for parts like ROM PROM FAMILY 020, 1026832, MM2716Q, D2716, MCM2716C within fifteen minutes.
| Alternative NSN: 5962-01-234-3570 |
| Item Name:Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 012343570 |
| NCB Code: USA (01) |
| Manufacturers: Dla Land And Maritime , Freescale Semiconductor Inc , Intel Corporation , National Semiconductor Corp , Raytheon Company , Raytheon Technical Services Company |
| Part No | Manufacturer | Item Name | QTY | RFQ |
|---|---|---|---|---|
| ROM PROM FAMILY 020 | dla land and maritime | microcircuit memory | Avl | RFQ |
| 1026832 | raytheon company | microcircuit memory | Avl | RFQ |
| 1026832 | raytheon technical services company | microcircuit memory | Avl | RFQ |
| MM2716Q | national semiconductor corp | microcircuit memory | Avl | RFQ |
| D2716 | intel corporation | microcircuit memory | Avl | RFQ |
| MCM2716C | freescale semiconductor inc | microcircuit memory | Avl | RFQ |
| D2718 | intel corporation | microcircuit memory | Avl | RFQ |
| 1026727-1 | raytheon technical services company | microcircuit memory | Avl | RFQ |
| 1026727-1 | raytheon company | microcircuit memory | Avl | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.285 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.600 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.187 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 525.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | +0.0/+70.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+125.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND ULTRAVIOLET ERASABLE AND STATIC OPERATION AND PROGRAMMABLE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 13 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 6.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
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