The parts under NSN 5962-01-233-8145 of Microcircuit Memory manufactured by Dla Land And Maritime, Intersil Corporation, Rockwell Collins Inc, Mmi Amd is available in our inventory. An ASAP Semiconductor Website, ASAP Aviation Stock has access to over three billion parts, paired with easy-to-use search engines that enable our customers to browse through our inventory quickly and efficiently. Our focus on quality control has earned us our AS9120B, ISO 9001:2015, and FAA 0056B certification, and we are the only independent distributor with a No China Sourcing pledge. If you are ready to get started, you can send us a Request for Quote for the parts with 5962-01-233-8145 from this webpage, and one of our account managers will give you a quote for parts like ROM PROM FAMILY 016, HM1-7649-8, 659 0189 002, 613-0761-002, 5349-1D 883 within fifteen minutes.
| Alternative NSN: 5962-01-233-8145 |
| Item Name:Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 012338145 |
| NCB Code: USA (01) |
| Manufacturers: Dla Land And Maritime , Intersil Corporation , Mmi Amd , Rockwell Collins Inc |
| Part No | Manufacturer | Item Name | QTY | RFQ |
|---|---|---|---|---|
| ROM PROM FAMILY 016 | dla land and maritime | microcircuit memory | Avl | RFQ |
| HM1-7649-8 | intersil corporation | microcircuit memory | Avl | RFQ |
| 659 0189 002 | rockwell collins inc | microcircuit memory | Avl | RFQ |
| 613-0761-002 | rockwell collins inc | microcircuit memory | Avl | RFQ |
| 5349-1D 883 | mmi amd | microcircuit memory | Avl | RFQ |
| 351-1809-012 | rockwell collins inc | microcircuit memory | Avl | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.010 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.308 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.220 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND 3-STATE OUTPUT AND ELECTROSTATIC SENSITIVE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 40.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 40.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 PRINTED CIRCUIT |
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