The parts under NSN 5962-01-228-8207 of Microcircuit Memory manufactured by Delco Electronics Corp, L 3 Communications Electronic, Dla Land And Maritime, Mmi Amd, Philips Semiconductors Inc is available in our inventory. An ASAP Semiconductor Website, ASAP Aviation Stock has access to over three billion parts, paired with easy-to-use search engines that enable our customers to browse through our inventory quickly and efficiently. Our focus on quality control has earned us our AS9120B, ISO 9001:2015, and FAA 0056B certification, and we are the only independent distributor with a No China Sourcing pledge. If you are ready to get started, you can send us a Request for Quote for the parts with 5962-01-228-8207 from this webpage, and one of our account managers will give you a quote for parts like 16007674-210, ROM PROM FAMILY 008, 5306-1J883B210, 82S131F883B210 within fifteen minutes.
| Alternative NSN: 5962-01-228-8207 |
| Item Name:Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 012288207 |
| NCB Code: USA (01) |
| Manufacturers: Delco Electronics Corp , Dla Land And Maritime , L 3 Communications Electronic , Mmi Amd , Philips Semiconductors Inc |
| Part No | Manufacturer | Item Name | QTY | RFQ |
|---|---|---|---|---|
| 16007674-210 | delco electronics corp | microcircuit memory | Avl | RFQ |
| 16007674-210 | l 3 communications electronic | microcircuit memory | Avl | RFQ |
| ROM PROM FAMILY 008 | dla land and maritime | microcircuit memory | Avl | RFQ |
| 5306-1J883B210 | mmi amd | microcircuit memory | Avl | RFQ |
| 82S131F883B210 | philips semiconductors inc | microcircuit memory | Avl | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.810 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.310 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.140 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND W/ENABLE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | ERR-060 NOMINAL HAND PULL AND ERR-060 NOMINAL HAND |
| CZER | MEMORY DEVICE TYPE | ROM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
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