The parts under NSN 5962-01-170-8174 of Microcircuit Memory manufactured by Dla Land And Maritime, G E C Marconi S3i Ltd, Mmi Amd, Bae Systems, Mbda Incorporated is available in our inventory. An ASAP Semiconductor Website, ASAP Aviation Stock has access to over three billion parts, paired with easy-to-use search engines that enable our customers to browse through our inventory quickly and efficiently. Our focus on quality control has earned us our AS9120B, ISO 9001:2015, and FAA 0056B certification, and we are the only independent distributor with a No China Sourcing pledge. If you are ready to get started, you can send us a Request for Quote for the parts with 5962-01-170-8174 from this webpage, and one of our account managers will give you a quote for parts like ROM PROM HEAD 053, 446 1 05381 003, PAL12L6MJ883B, PAL-004, B84674 within fifteen minutes.
Alternative NSN: 5962-01-170-8174 |
Item Name:Microcircuit Memory |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 011708174 |
NCB Code: USA (01) |
Manufacturers: Bae Systems , Dla Land And Maritime , G E C Marconi S3i Ltd , Mbda Incorporated , Mmi Amd |
Part No | Manufacturer | Item Name | QTY | RFQ |
---|---|---|---|---|
ROM PROM HEAD 053 | dla land and maritime | microcircuit memory | Avl | RFQ |
446 1 05381 003 | g e c marconi s3i ltd | microcircuit memory | Avl | RFQ |
PAL12L6MJ883B | mmi amd | microcircuit memory | Avl | RFQ |
PAL-004 | bae systems | microcircuit memory | Avl | RFQ |
B84674 | mbda incorporated | microcircuit memory | Avl | RFQ |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 1.090 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.185 INCHES MAXIMUM |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | PROGRAMMABLE AND HIGH SPEED AND 3-STATE OUTPUT AND BIPOLAR AND SCHOTTKY |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 12 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
CZER | MEMORY DEVICE TYPE | ROM |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 20 PRINTED CIRCUIT |
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