The parts under NSN 5962-01-043-1614 of Microcircuit Memory manufactured by Dla Land And Maritime, Intel Corporation, Advanced Micro Devices Inc is available in our inventory. An ASAP Semiconductor Website, ASAP Aviation Stock has access to over three billion parts, paired with easy-to-use search engines that enable our customers to browse through our inventory quickly and efficiently. Our focus on quality control has earned us our AS9120B, ISO 9001:2015, and FAA 0056B certification, and we are the only independent distributor with a No China Sourcing pledge. If you are ready to get started, you can send us a Request for Quote for the parts with 5962-01-043-1614 from this webpage, and one of our account managers will give you a quote for parts like ROM PROM HEAD 034, MC1702A B, DMS 84124B, AM9702AHDL-B within fifteen minutes.
Alternative NSN: 5962-01-043-1614 |
Item Name:Microcircuit Memory |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 010431614 |
NCB Code: USA (01) |
Manufacturers: Advanced Micro Devices Inc , Dla Land And Maritime , Intel Corporation |
Part No | Manufacturer | Item Name | QTY | RFQ |
---|---|---|---|---|
ROM PROM HEAD 034 | dla land and maritime | microcircuit memory | Avl | RFQ |
MC1702A B | intel corporation | microcircuit memory | Avl | RFQ |
DMS 84124B | dla land and maritime | microcircuit memory | Avl | RFQ |
AM9702AHDL-B | advanced micro devices inc | microcircuit memory | Avl | RFQ |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 1.180 INCHES MINIMUM AND 1.220 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.560 INCHES MINIMUM AND 0.600 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.100 INCHES MINIMUM AND 0.140 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 2.0 WATTS |
AFGA | OPERATING TEMP RANGE | -55.0 TO 85.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS AND W/ENABLE AND W/BUFFERED OUTPUT AND PROGRAMMABLE AND PROGRAMMED AND EXPANDABLE AND W/DECODED OUTPUT AND 3-STATE OUTPUT AND WIRE-OR OUTPUTS AND HIGH SPEED |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | P-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 48.0 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 1000.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
CZER | MEMORY DEVICE TYPE | ROM |
TEST | TEST DATA DOCUMENT | 28815-17-123497 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DR |
TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
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