The parts under NSN 5962-00-536-0447 of Microcircuit Memory manufactured by Philips Semiconductors Inc, Dla Land And Maritime, Freescale Semiconductor Inc, Bae Systems Information And Electronic Systems Integration Inc, Fairchild Semiconductor Corporation is available in our inventory. An ASAP Semiconductor Website, ASAP Aviation Stock has access to over three billion parts, paired with easy-to-use search engines that enable our customers to browse through our inventory quickly and efficiently. Our focus on quality control has earned us our AS9120B, ISO 9001:2015, and FAA 0056B certification, and we are the only independent distributor with a No China Sourcing pledge. If you are ready to get started, you can send us a Request for Quote for the parts with 5962-00-536-0447 from this webpage, and one of our account managers will give you a quote for parts like CB130E, ROM PROM FAMILY 003, SCM563L, 310119P3, HL40260 within fifteen minutes.
Alternative NSN: 5962-00-536-0447 |
Item Name:Microcircuit Memory |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 005360447 |
NCB Code: USA (00) |
Manufacturers: Bae Systems Information And Electronic Systems Integration Inc , Dla Land And Maritime , Fairchild Semiconductor Corporation , Freescale Semiconductor Inc , Philips Semiconductors Inc |
Part No | Manufacturer | Item Name | QTY | RFQ |
---|---|---|---|---|
CB130E | philips semiconductors inc | microcircuit memory | Avl | RFQ |
ROM PROM FAMILY 003 | dla land and maritime | microcircuit memory | Avl | RFQ |
SCM563L | freescale semiconductor inc | microcircuit memory | Avl | RFQ |
310119P3 | bae systems information and electronic systems integration inc | microcircuit memory | Avl | RFQ |
HL40260 | fairchild semiconductor corporation | microcircuit memory | Avl | RFQ |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.750 INCHES MINIMUM AND 0.795 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.120 INCHES MINIMUM AND 0.195 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 625.0 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/ENABLE AND PROGRAMMABLE AND PROGRAMMED AND BIPOLAR AND W/BUFFERED OUTPUT AND W/DECODED OUTPUT AND EXPANDABLE AND HIGH SPEED AND WIRE-OR OUTPUTS |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 6 INPUT |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | -0-001-AG JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
CZER | MEMORY DEVICE TYPE | ROM |
CZZZ | MEMORY CAPACITY | UNKNOWN |
TEST | TEST DATA DOCUMENT | 94117-310119 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWI |
TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
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